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Name： DMI Motor Cooling System
Numbers：
Postdate：2014-01-20
Surface: ENIG
Laminate: FR4 and Thermal Conductivity IMS material
Board Thk: 1.6-2.4mm
Min VIA: 0.3mm
Min Dielectric Thk:0.2mm
Layer: 2L FR4 + IMS
FR4 PCB VIA: Resin Plugging
Cu layer: 2OZ base min
Hi-Pot:3000 VDC
Thermal Resistance:<1 K.cm2/W